Vector Series 440: A Convertible 7U Platform for Vertical VME, cPCI, and VPX Cards

Selecting a chassis for a modular embedded computing system is primarily a mechanical and integration decision.
The enclosure must establish the card geometry, backplane interface, cooling path, power architecture, rack interface, and service access before the system reaches electrical or environmental testing.

The Vector Series 440 addresses applications that require vertical installation of 3U or 6U Eurocards in a 19-inch enclosure, while retaining the option to operate the same platform as a desktop unit. Its architecture is intended for systems using VME, VME64x, CompactPCI, or VPX backplanes and 160 mm card depths.

The design is defined by four characteristics:

A 7U-high, 19-inch rackmount form factor
A 6U × 160 mm front card cage that can be divided into two 3U sections
Compatibility with 3U and 6U VME, VME64x, cPCI, and VPX backplanes
A removable-bracket design that allows conversion between rackmount and desktop configurations

Mechanical envelope and card compatibility

The Series 440 has a nominal height of 7U, or 12.22 inches (310.39 mm), and a width of 19 inches (482.6 mm). The rack interface follows the EIA-310D 19-inch equipment standard. The chassis depth is 15.07 inches (383 mm), sized for cards with a 160 mm depth.

The front card cage is configured for 6U × 160 mm cards. It can also be split into two independent 3U × 160 mm sections. This allows a system designer to combine card formats or isolate different functional groups within one enclosure, provided that the selected backplane and mechanical hardware match the intended configuration.

The relevant mechanical standards are IEEE 1101.1 and IEEE 1101.10. These standards establish important dimensions and mechanical provisions for Eurocard-based systems, including card insertion geometry, subrack interfaces, and electromagnetic compatibility considerations. Compliance with the applicable mechanical details helps reduce problems involving card alignment, guide positioning, connector engagement, and front-panel fit.

The chassis is constructed from aluminum. For a system integrator, the material choice affects more than enclosure weight. It also contributes to the mechanical structure, panel fabrication, service access, and thermal path. Final system performance still depends on the card power dissipation, backplane configuration, airflow resistance, fan operating point, and installation conditions.

Why the split-cage architecture matters

A single 6U card cage is appropriate when the system is built around a common 6U backplane and a consistent card population. That arrangement provides a straightforward mechanical and electrical architecture for systems in which processors, payload cards, I/O cards, and peripheral functions share one bus or fabric.

The ability to split the cage into two 3U sections becomes useful when the system has more than one card domain. Typical examples include:

A legacy 3U VME or cPCI subsystem installed alongside a newer 3U VPX subsystem
Separate processing and instrumentation sections with different backplane requirements
A test platform that must accommodate multiple card standards during development
A system refresh in which existing 3U cards must remain operational while new hardware is integrated
A mixed configuration in which one section is populated and the other is reserved for future expansion

The split is not a substitute for electrical architecture. Each section still requires the correct backplane, connector arrangement, power distribution, card guides, front-panel geometry, and signal-integrity treatment. The practical value is that those functions can be organized within one 7U enclosure rather than distributed across separate chassis.

The configuration should therefore be established from the backplane outward. Card height, connector position, slot pitch, keying, guide location, rear I/O, power entry, and cooling requirements should be reviewed together. A card that is electrically compatible with a bus may still be mechanically unsuitable if its front panel, ejector hardware, rear transition interface, or depth does not match the chassis configuration.

Rackmount-to-desktop conversion

The Series 440 uses removable rack brackets to support two installation modes. With the brackets installed, the enclosure can be mounted in a standard 19-inch equipment rack. With the brackets removed, the same chassis can be used as a desktop platform.

This conversion matters during different stages of a product program.

During development, integration engineers may need direct access to card fronts, rear I/O, cabling, and measurement equipment. A desktop configuration can simplify access on a laboratory bench and reduce the mechanical constraints associated with rack installation. Once the system is deployed in an equipment cabinet, the brackets can be installed to establish the rack-mounted configuration.

The same feature can also support manufacturing and service workflows. A chassis can be assembled, wired, and tested outside the rack, then installed without redesigning the enclosure around a different platform. This is particularly relevant when a system transitions from prototype evaluation to rack-based test or deployment.

Conversion should not be treated as a change in system architecture. Removing the brackets changes the mounting method, not the card cage, backplane, power arrangement, or thermal design. The enclosure must remain supported and positioned so that airflow openings, rear fan assemblies, connectors, and cable paths are not obstructed in either configuration.

Airflow and thermal considerations

The Series 440 uses front air intake and rear exhaust. Three 120 mm axial fans are mounted on the rear panel for exhaust.

This arrangement establishes a front-to-rear cooling path through the card cage. In a populated system, the dominant thermal variables are the total card load, the pressure drop across the card guides and backplane region, the resistance of front panels or slot covers, and the temperature of the incoming air.

A disciplined thermal review should account for:

The maximum power dissipation of each installed card
The distribution of high-power cards across the backplane
Open and occupied slot positions
Cable bundles and rear I/O obstructions
Fan voltage, speed, noise, and expected service life
Rack airflow and clearance around the rear exhaust
The allowable temperature at the card inlet and outlet

The published operating temperature range for the Series 440 is 0°C to 50°C. The non-operating range is -40°C to 75°C. These values define the stated chassis environmental range; they do not replace component-level limits for processors, FPGAs, power supplies, connectors, or storage devices.

The chassis also specifies 5–95% relative humidity, non-condensing, and UL94V-0 flammability performance. System-level environmental qualification remains dependent on the complete assembly and its intended application.

Power supply architecture

The Series 440 supports either a plug-in power supply or an embedded industrial-type power supply.

The plug-in option is specified as a 3U or 6U × 8HP × 160 mm module and references PICMG 2.11 Revision 1.0. This approach is useful when the power supply must occupy a defined card position and interface with the system power distribution structure. It can also simplify replacement or configuration changes when the power module is treated as a serviceable plug-in unit.

An embedded supply provides a different mechanical arrangement. It may be appropriate when the system requires a fixed internal power architecture, a particular input configuration, or a power solution that does not use a plug-in slot. The choice should be made alongside the backplane, card population, input power, current demand, hold-up requirements, protection features, and thermal budget.

The Series 440 product information also identifies options for local voltage monitoring through LEDs and remote monitoring through RJ-45 or RS-485 interfaces. These functions should be specified according to the system’s control and maintenance architecture rather than added after the enclosure layout is complete.

Configuration control for mixed-generation systems

VME and VME64x systems often remain in service long after their original development cycle. CompactPCI and VPX systems can introduce different connector, power, cooling, and rear-I/O requirements. A chassis that can accommodate multiple backplane families is valuable only when the configuration is controlled precisely.

For a Series 440 implementation, the configuration record should identify at least:

Card height and depth for every slot
Backplane type, slot count, connector arrangement, and bus topology
3U or 6U cage division
Card-guide and front-panel requirements
Power supply type and electrical ratings
Fan arrangement and airflow direction
Rear I/O and cable-routing provisions
Monitoring interfaces and status indicators
Mechanical modifications or custom backplane requirements

Vector identifies the Series 440 as fully assembled, wired, and tested. For a system program, that distinction is important because enclosure assembly is part of the functional system, not merely packaging. The test-ready condition should include the installed backplane, power distribution, card guides, fans, wiring, monitoring provisions, and configuration documentation required for the intended build.

When Series 440 is the appropriate platform

The Series 440 is suited to applications where vertical 3U or 6U cards must be integrated into a 7U, 19-inch enclosure and where the installation may change between laboratory, integration, and rack environments.

Its convertible mounting arrangement is most relevant when a program needs one mechanical platform across development and deployment. Its split card cage is most relevant when two 3U card domains must share an enclosure or when a system must support a controlled transition between legacy and newer architectures. Its 160 mm card depth and backplane compatibility make it a practical starting point for VME, VME64x, cPCI, and VPX system definition.

The governing principle is to select the enclosure, backplane, power supply, cooling path, and card population as one controlled assembly. Mechanical compatibility alone does not guarantee a reliable system. The Series 440 provides the platform; system performance depends on the discipline used to configure and verify everything installed within it.